T-MUSIC semiconductor programme moves to Phase 2
T-MUSIC seeks to develop disruptive high-performance RF technologies for defence applications. (Photo: DARPA)
BAE Systems gains a follow-on contract from DARPA to work on Phase 2 of the Technologies for Mixed-mode Ultra Scaled Integrated Circuits (T-MUSIC) programme.
The Fast Labs R&D organisation within BAE Systems is to continue work for DARPA on the Technologies for Mixed-mode Ultra Scaled Integrated Circuits (T-MUSIC) programme.
Following the completion of T-MUSIC Phase 1, Fast Labs received a $5 million contract for Phase 2.
Work will include the development of a 400-600GHz transistor with digital complementary metal-oxide semiconductor (CMOS).
T-MUSIC is designed to enable disruptive RF mixed-mode technologies by developing next-generation terahertz transistors beyond modern limitations (as per Moore’s Law).
High-performance RF analogue electronics would be integrated with advanced digital electronics on the same wafer, BAE Systems noted in a 30 March statement.
It added: ‘This technology supports critical communications, radar, and electronic warfare (EW) capabilities, and is widely used to support commercial telecommunications’.
Potential next-generation capabilities for the US military could include a combination of wide spectral coverage, high resolution, large dynamic range, and high information processing bandwidth.
‘As services rely on electronic sensors in highly congested environments, these capabilities can cut through electronic signal clutter to provide mission-critical leap-forward performance,’ BAE Systems noted.
In Phase 3 of T-MUSIC, planned for FY2023, DARPA envisages a 600-700GHz transistor giving a 90% CMOS process control monitoring yield per wafer.
More from Digital Battlespace
-
![Orbiting the Future: How New Satellite Technologies are Revolutionising Global Communications]()
Orbiting the Future: How New Satellite Technologies are Revolutionising Global Communications
With the satellite industry at a pivotal juncture, Intelsat is investing in advanced technologies like 5G and optical communications, striving to enhance worldwide connectivity and address emerging governmental needs.
-
![Leidos to support DoD Joint Staff C2 system under $74 million contract]()
Leidos to support DoD Joint Staff C2 system under $74 million contract
Leidos has been awarded a five-year, $74 million contract to provide analytical and engineering support for Combined Joint All-Domain Command and Control (CJADC2) to the US DoD Joint Staff (JS) J6 Joint Assessment Division (JAD).
-
DSEI 2023: Controp unveils Smart Vision AI software for EO/IR payloads
Controp Precision Technologies unveiled its Smart Vision AI software for enhancing the level of autonomy and automation for a variety of surveillance and reconnaissance missions at DSEI 2023.
-
![Space Systems Technology Report 2023 now available to read]()
Space Systems Technology Report 2023 now available to read
Unlocking the potential of satellite technology for communications and intelligence-gathering.
-
![DSEI 2023: APS claims 90% success rate in tracking drones in Ukraine]()
DSEI 2023: APS claims 90% success rate in tracking drones in Ukraine
Advanced Protection System (APS) has reported a 90% success in tracking Russian UAVs operating in the Ukraine war using its SKYctrl anti-drone system.
-
![DSEI 2023: First Azalea satellite cluster set for launch in early 2025]()
DSEI 2023: First Azalea satellite cluster set for launch in early 2025
The first four multi-sensor Low-Earth Orbit (LEO) satellites forming the first cluster of Azalea will be launched in early 2025 as part of a BAE Systems effort to demonstrate capability to the UK government and other potential customers.
