Tekever unveils new swarm-controlling UAS
Tekever has manufactured the AR3, AR4 and AR5 UAS with all systems sharing common electronics and software architecture, which has enabled the reuse of ground segment elements within the new ARX UAS.
DecaWave the Dublin-based pioneering fabless semiconductor company, has announced that US sensor innovator MicroStrain, has chosen to implement DecaWave’s ScenSor wireless radio chips.
The combination of DecaWave ScenSor’s ultra wide band (UWB) radio technology with MicroStrain’s energy harvesting wireless sensor networks will lead to significant breakthroughs towards the realization of widespread sensing networks.
The machines and structures of the future will be loaded with a rich network of tiny wireless sensing nodes – that automatically monitor and report on structural and operational health – without the need for battery maintenance.
MicroStrain’s sensors are used in a wide range of applications, including knee/spine implants, bridges, unmanned vehicles, heavy machinery, fixed-wing aircraft, and helicopters.
The wireless nature of many of these applications necessitates ultra low power and energy harvesting. DecaWave’s ScenSor offers an ultra-low complexity coherent receiver, simultaneously giving MicroStrain the benefits of superior range at ultra-low power consumption. The two firms connected during a November 2008 trade mission spearheaded by Senator Patrick Leahy of Vermont.
“We are delighted that MicroStrain will be one of the first companies to receive DecaWave’s ultra wideband (UWB) radio chips, which represent a breakthrough for wireless sensors”, says Steve Arms, President and CEO, MicroStrain. “DecaWave’s ScenSor operates at 10X lower energy levels and communicates at rates 20X faster than our current radio chips, resulting in an overall energy savings of 200 fold. This will enable MicroStrain’s energy harvesting wireless sensors to be smaller, faster, and even more versatile.”
“DecaWave is delighted that such a proven and successful innovator as MicroStrain has chosen ScenSor,” says Ciaran Connell, DecaWave CEO. “ScenSor’s ultra low power capability is unrivalled, and is highly suited to the energy requirements of MicroStrain’s portfolio of sensor applications, and opens up enormous potential in the wireless sensor sector.”
DecaWave’s flagship product ScenSor is a complete, single chip CMOS ultra-wideband IC based on the IEEE 802.15.4a standard. The resulting silicon has a wide range of standards-based applications for both Ultra Low Power Wireless Transceivers and Real Time Location Systems (RTLS).
Tekever has manufactured the AR3, AR4 and AR5 UAS with all systems sharing common electronics and software architecture, which has enabled the reuse of ground segment elements within the new ARX UAS.
As the dynamics of aerial combat rapidly evolve, Chinese scientists have engineered a sophisticated air separation drone model that can fragment into up to six drones, each capable of executing distinct battlefield roles and challenging the efficacy of current anti-drone defences such as the UK’s Dragonfire laser system.
Advancements in air defence technologies have begun to reshape aerial combat dynamics in the Middle East, as illustrated by recent events involving the Israeli Air Force and Hezbollah.
Both sides of the Russia-Ukraine war have been using UAS for effective low-cost attacks, as well as impactful web and social media footage. Thousands more have now been committed to Ukrainian forces.
The US Army has intentions to develop light, medium and heavy variants of the Robotic Combat Vehicle (RCV) as part of the branche’s Next Generation Combat Vehicle family.
DroneSentry-X, a cross-vehicle compatible, automated 360° C-UAS detect and defeat device, can offer 360° awareness and protection using integrated sensors. According to its manufacturer, it is suitable for mobile operations, on-site surveillance and on-the-move missions.